San Diego, CA – June 8, 2018: Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15, 2018 in Philadelphia, PA.

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