San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs.

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