Quik-Pak Hosts IMAPS Technical Presentation on the Challenges of Die Stacking

San Diegom CA, October 26 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps between the wires, die, & components used in the RF modules.

Mark Kuhlman a Senior Principal Engineer at Skyworks Solutions led the presentation.