Archives: People

Dave joined Promex in 2023 and became president and COO of Promex and QP in 2026. Earlier in his career, he led research and development for hardware and technology for next-generation platforms at Cepheid as director of instrument research. He also has experience as a senior optical scientist at Theranos and research scientist at Agilent Technologies. He earned a PhD in physical chemistry at Stanford University and a B.A. in biochemistry from the University of Colorado-Boulder. He holds multiple patents for molecular diagnostics systems and high-speed atomic force microscopy.

Séamus joined QP Technologies in Jan 2026 as Vice President of Operations. He oversees all operational activities at our Escondido facility, including manufacturing, materials supply chain, quality and engineering. Across his 4 decades at blue ribbon IT sector companies, Séamus has a proven track record of driving results through operational excellence. He has held engineering and operational leadership roles at Ericsson, Apple, Intel, Luxtera, and more recently, Cisco. A native of Boyle, County Roscommon, Ireland, Séamus obtained his engineering degree in electronics at the University of Limerick.

Ben joined QP Technologies as VP of Military Projects in 2025. A veteran of more than 40 years in high-reliability microelectronics, he will drive the company’s mil-aero strategy, including pursuing Mil-PRF certifications, extending ISO/AS9100 coverage, and ensuring robust ITAR compliance. He will also lead outreach with government and industry task forces to align Promex and QP with evolving defense standards.

In his role as CEO, Dick brings more than 50 years of technical and executive electronics manufacturing experience to both QP Technologies and our parent company, Promex Industries, Incorporated. His keen business acumen keeps us on a profitable, steady growth path. Dick believes in the power of industry involvement, and is active in IEEE, IMAPS and OSA. He is also involved in many industry roadmap activities through the IPC, iNEMI and the ITRS Assembly and Packaging Subcommittee, and he chairs the PSMC Assembly and Test Working Group of the Photonics Systems Manufacturing Consortium (PSMC). Previously, he was general manager of Kaptron, president of Advanced Packaging Systems, and held executive and engineering positions at Raychem. Dick earned his MBA from Harvard University and BSEE and MSEE degrees from MIT.