Archives: People

Rosie joined Promex Industries in 2015.  She has over 30 years of experience in the semiconductor industry serving commercial, medical, and mil-aero customers. In managing business development, sales, marketing and customer support, she plays a vital role in supporting QP Technologies’ growth. Rosie also works closely with executive management on strategic engineering and manufacturing initiatives designed to fast track customer’s products from prototype to volume production. After attending Evergreen Valley College in San Jose, CA, Rosie launched a career in customer service at Norsk Engineering. She later joined CORWIL Technology, where she held various sales and customer support positions before being named director of medical technology business development.

Ken joined QP Technologies as Chief Operating Officer in 2019. He is responsible for all operations at the Escondido facility, including growing the business, monitoring financial performance, expanding production capacity and strengthening the company’s infrastructure. Before he joined QP Technologies, Ken was the COO of  Integra Technologies and oversaw facilities located in Kansas, New Mexico and Milpitas, Calif. He has also previously served as VP of Operations for Sierra Monolithics/Semtech, Staccato Communications, TelASIC Communications and Accelarant Networks. Earlier in his career, Ken held operations and engineering management positions at Dallas Semiconductor, Cypress Semiconductor and Mostek Corp. Ken earned a BSEE in semiconductors from the University of Illinois at Urbana-Champaign.

In his role as CEO, Dick brings more than 50 years of technical and executive electronics manufacturing experience to both QP Technologies and our parent company, Promex Industries, Incorporated. His keen business acumen keeps us on a profitable, steady growth path. Dick believes in the power of industry involvement, and is active in IEEE, IMAPS and OSA. He is also involved in many industry roadmap activities through the IPC, iNEMI and the ITRS Assembly and Packaging Subcommittee, and he chairs the PSMC Assembly and Test Working Group of the Photonics Systems Manufacturing Consortium (PSMC). Previously, he was general manager of Kaptron, president of Advanced Packaging Systems, and held executive and engineering positions at Raychem. Dick earned his MBA from Harvard University and BSEE and MSEE degrees from MIT.