Steve Swendrowski joined QP Technologies (then Quik-Pak) as a contract engineer in 2001, became general manager in 2005, and, in 2020, was named director of engineering. He currently serves as Director of Operations. With 30-plus years of industry experience, Steve draws on his wealth of engineering background and know-how to continue advancing QP’s technology capabilities.
Steve’s efforts helped drive our broad line of pre-molded air-cavity QFNs, called our Open-molded Plastic Package (OmPP™) technology, which has grown to be a significant part of our business. Steve began his career as a tool and die maker for an early digital watch maker, then transitioned into the semiconductor industry, joining Texas Instruments’ mil-aero group in Dallas. Following TI, Steve developed DRAMs at Mostek (now part of STMicroelectronics), then spent some time at Intel before relocating to San Diego and eventually joining QP Technologies.
Annette Aquino joined QP in 2022 as Quality Assurance Manager and currently serves as Director of Quality Assurance. She has over a decade of experience in quality management, assurance, and compliance, primarily with companies in aerospace and defense. Prior to coming on board at QP Technologies, Annette held a succession of positions with companies that included Machinetek, TTM Technologies, Laird R&F Technologies, and Argen Corp. She is proficient in internal auditing for key certifications, including AS9100D, ISO 9001, ISO 13485, MDSAP, ISO 14001 and ISO 45001.
A tech industry veteran, Matt has more than 25 years of sales, marketing and business development experience. In addition to medtech, his expertise includes the military-aerospace market, microelectro-mechanical systems (MEMS) and sensors, semiconductor test and measurement, and advanced thermodynamics. Matt has a proven track record of consistent revenue attainment and contributing to average revenue growth exceeding 25% year-over-year. Prior to joining QP Technologies, Matt held VP of sales and marketing positions at TFE and TSE, Korean makers of load boards, test sockets and other components for semiconductor test, broadening the companies’ market reach in North America. Before that, his succession of positions included global account manager with electronic components maker Smiths Interconnect; CEO of test socket maker OKins USA; and VP of sales and marketing for U.S.-based outsourced semiconductor, assembly and test (OSAT) provider CORWIL Technology. Other previous experience includes stints with Antares-ATT, Enplas-Tesco and Hunter Technologies.
Ben joined QP Technologies as VP of Military Projects in 2025. A veteran of more than 40 years in high-reliability microelectronics, he will drive the company’s mil-aero strategy, including pursuing Mil-PRF certifications, extending ISO/AS9100 coverage, and ensuring robust ITAR compliance. He will also lead outreach with government and industry task forces to align Promex and QP with evolving defense standards.
In his role as CEO, Dick brings more than 50 years of technical and executive electronics manufacturing experience to both QP Technologies and our parent company, Promex Industries, Incorporated. His keen business acumen keeps us on a profitable, steady growth path. Dick believes in the power of industry involvement, and is active in IEEE, IMAPS and OSA. He is also involved in many industry roadmap activities through the IPC, iNEMI and the ITRS Assembly and Packaging Subcommittee, and he chairs the PSMC Assembly and Test Working Group of the Photonics Systems Manufacturing Consortium (PSMC). Previously, he was general manager of Kaptron, president of Advanced Packaging Systems, and held executive and engineering positions at Raychem. Dick earned his MBA from Harvard University and BSEE and MSEE degrees from MIT.
