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A tech industry veteran, Matt has more than 25 years of sales, marketing and business development experience. In addition to medtech, his expertise includes the military-aerospace market, microelectro-mechanical systems (MEMS) and sensors, semiconductor test and measurement, and advanced thermodynamics. Matt has a proven track record of consistent revenue attainment and contributing to average revenue growth exceeding 25% year-over-year. Prior to joining QP Technologies, Matt held VP of sales and marketing positions at TFE and TSE, Korean makers of load boards, test sockets and other components for semiconductor test, broadening the companies’ market reach in North America. Before that, his succession of positions included global account manager with electronic components maker Smiths Interconnect; CEO of test socket maker OKins USA; and VP of sales and marketing for U.S.-based outsourced semiconductor, assembly and test (OSAT) provider CORWIL Technology. Other previous experience includes stints with Antares-ATT, Enplas-Tesco and Hunter Technologies.

Ken joined QP Technologies as Chief Operating Officer in 2019. He is responsible for all operations at the Escondido facility, including growing the business, monitoring financial performance, expanding production capacity and strengthening the company’s infrastructure. Before he joined QP Technologies, Ken was the COO of  Integra Technologies and oversaw facilities located in Kansas, New Mexico and Milpitas, Calif. He has also previously served as VP of Operations for Sierra Monolithics/Semtech, Staccato Communications, TelASIC Communications and Accelarant Networks. Earlier in his career, Ken held operations and engineering management positions at Dallas Semiconductor, Cypress Semiconductor and Mostek Corp. Ken earned a BSEE in semiconductors from the University of Illinois at Urbana-Champaign.

In his role as CEO, Dick brings more than 50 years of technical and executive electronics manufacturing experience to both QP Technologies and our parent company, Promex Industries, Incorporated. His keen business acumen keeps us on a profitable, steady growth path. Dick believes in the power of industry involvement, and is active in IEEE, IMAPS and OSA. He is also involved in many industry roadmap activities through the IPC, iNEMI and the ITRS Assembly and Packaging Subcommittee, and he chairs the PSMC Assembly and Test Working Group of the Photonics Systems Manufacturing Consortium (PSMC). Previously, he was general manager of Kaptron, president of Advanced Packaging Systems, and held executive and engineering positions at Raychem. Dick earned his MBA from Harvard University and BSEE and MSEE degrees from MIT.