Steve Swendrowski joined QP Technologies (then Quik-Pak) as a contract engineer in 2001, became general manager in 2005, and, in 2020, was named director of engineering. He currently serves as Director of Operations. With 30-plus years of industry experience, Steve draws on his wealth of engineering background and know-how to continue advancing QP’s technology capabilities.
Steve’s efforts helped drive our broad line of pre-molded air-cavity QFNs, called our Open-molded Plastic Package (OmPP™) technology, which has grown to be a significant part of our business. Steve began his career as a tool and die maker for an early digital watch maker, then transitioned into the semiconductor industry, joining Texas Instruments’ mil-aero group in Dallas. Following TI, Steve developed DRAMs at Mostek (now part of STMicroelectronics), then spent some time at Intel before relocating to San Diego and eventually joining QP Technologies.