The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

DPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Stop by our exhibit table as we share the latest and greatest innovations from our packaging and assembly experts and how we can provide quickturn support to your manufacturing processes!

Meet with us at iMAPS DPC 2024. Contact us at sales@qptechnologies.com today.