Meet with us at iMAPS DPC 2023. Contact us at today.

The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events.

Stop by our exhibit table #43 as we share the latest and greatest innovations from our packaging and assembly experts and how we can provide quickturn support to your manufacturing processes. In addition be sure to attend our Sam Sadri’s presentation, “Optimizing New Power Switch Technology Using Flip-Chip Assembly,” on Wednesday, March 15, at 5:30 p.m. Sam will detail how QP worked with startup company Ideal Power to create a manufacturable packaging solution for their innovative B-TRAN™ bidirectional power switch.