Skip to content
Primary Menu
Search
Customer Portal
858.674.4676
Request Quote
Services
Wafer Preparation
[title]
Wafer Backgrinding and Dicing
Additional Wafer Preparation Services
Advanced Assembly
[title]
Chip on board / Chip on flex
Chiplets
Flip Chip Bonding
Inventory Management / BOM Procurement
Multi Chip Module
SMT
Stacked Die
System In Packaging
Design & Engineering
IC Assembly
[title]
Air Cavity QFN Open Molded Plastic Package
BGA Substrates
Ceramic
Custom Configurations
Die Attach
Encapsulation Options
IC Marking / IC Branding
Open Cavity Plastic Packages
Plastic Overmolded QFN Open-tooled
Wire Bonding
Leaded Plastic Package Drawings
Laser Micromachining
Substrate Development
[title]
Substrate Design
Substrate Fabrication & Assembly
Custom Substrates
Products
OCPP
OmPP
Overmolded QFN/DFN
Leaded Plastic Package
Ceramic Packages
Markets Served
Automotive
Commercial
Compound Semiconductors
Industrial
Medical
Mil-Aero
Power Semiconductors
About Us
Company Info/Bios
Careers
Quality
Contact Us
Request Quote
Technical Resources
Package Drawings
Materials Information
Technical Articles, Tech Tips, White Papers
Technical Information
News & Events
News
Events
Blog
QP Newsletter Archive
Quick Shots Archive
iMAPS Device Packaging Conference
March 07, 2022
»
March 10, 2022
We-Ko-Pa Resort & Conference Center Fountain Hills, Arizona
,
Fountain Hills, AZ
https://www.imaps.org/device_packaging_conference.php
Request a Meeting at iMAPS Device Packaging Conference
Search for:
Click to access the login or register cheese
