News

Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and […]

Learn More

San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs.

Learn More

San Diego, CA, March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping. Download Press Release

Learn More

San Diego, CA, Febuary 4 2011:Quik-Pak Hosts IMAPS Event About the Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology. IMAPS Event begins on Tuesday, February 22 at 12:00. Download Press Release

Learn More

San Diego, CA, November 10, 2010:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has expanded its services to include submicron placement accuracy as part of its flip chip bonding capabilities. Download Article

Learn More

San Diegom CA, October 26 2010: The technical presentation addresses the status of die stacking in the industry and the challenges of die stacking, especially for RF devices. Skyworks Solutions has reduced die sizes for silicon and GaAs, introduced the smallest component sizes called “01005”, and has shrunk the available gaps […]

Learn More

San Diego, CA, October 10, 2010: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores. Download Press Release

Learn More

February 2010: Julie Adams, Quik-Pak Sales Director, discusses “selling time” in the Feb. issue of US Tech. Read the Article

Learn More

January 12, 2010: Jeanne Beacham, Delphon CEO, discusses her outlook on 2010 in Semiconductor Packaging News Viewpoint Article. Read the Article

Learn More

November 2009: Infrastructure Advisor’s Ron Lecke and Quik-Pak’s Howard Lenos discuss the latest in CZT Detector Assembly. Read the Article

Learn More

San Diego, CA, August 25, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military […]

Learn More

San Diego, CA, April 16, 2009: Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced the completion of its new expanded facility today. The company has added 5,800 sq ft of new clean manufacturing space which houses advanced […]

Learn More