Product Spotlight: Stacked Die
San Diego, CA, May 1, 2013: Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process.
Product Spotlight: Flip Chip
San Diego, CA, April 1, 2013: Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.
Product Spotlight: Wafer Dicing
San Diego, CA, March 1, 2013: Quik-Pak can receive your wafer in the morning and ship completely assembled packages by the end of the day!
Quik-Pak Expands NEW Open-molded Plastic Package (OmPP)® Product Family with 8-Lead SOIC
San Diego, CA, September 18, 2012: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announces its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)® product line. Download Press Release
Quik-Pak Announces Copper Wire Bonding
San Diego, CA, December 15, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. Download Press Release
Quik-Pak Presented at this year’s TowerJazz Global Symposium Aerospace and Defense Day
San Diego, CA, December 14, 2011: Casey Krawiec, Global Sales and Marketing Manager for Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, presented on Aerospace and Defense Day, November 2nd, at the TowerJazz Global Symposium. The title of his presentation was, "Enabling Innovation". Download Presentation
Quik-Pak Awarded Plaque by IMAPS
San Diego, CA, September 27 2011:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, was awarded a plaque today by the International Microelectronics and Packaging Society (IMAPS) for their support as a premier corporate member of the organization. Download Press Release
Quik-Pak Expands Open-molded Plastic Package (OmPP) Product Family
San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective…
Delphon Announces Partnership with Neu Dynamics Corporation
Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and…
Quik-Pak Announces Open-molded Plastic Packages (OmPP)
San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs.
Quik-Pak Offers Innovative Approach to Bumping Single Die
San Diego, CA, March 3, 2011: Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an innovative approach to prototype die bumping. Download Press Release
Quik-Pak Hosts IMAPS Event at San Diego Offices
San Diego, CA, Febuary 4 2011:Quik-Pak Hosts IMAPS Event About the Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology. IMAPS Event begins on Tuesday, February 22 at 12:00. Download Press Release