News

Product Spotlight: OmPP for Design Engineers

San Diego, CA, July 1, 2013: For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-molded Plastic Packages) provide a cost effective solution.

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Product Spotlight: Stacked Die

San Diego, CA, May 1, 2013: Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process.

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Product Spotlight: Flip Chip

San Diego, CA, April 1, 2013: Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.

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Quik-Pak Announces Copper Wire Bonding

San Diego, CA, December 15, 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. Download Press Release

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Quik-Pak Awarded Plaque by IMAPS

San Diego, CA, September 27 2011:Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, was awarded a plaque today by the International Microelectronics and Packaging Society (IMAPS) for their support as a premier corporate member of the organization. Download Press Release

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Quik-Pak Expands Open-molded Plastic Package (OmPP) Product Family

San Diego, CA, June 1st 2011: Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly announced today its exclusive Open-molded Plastic Package (Ompp)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective…

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Delphon Announces Partnership with Neu Dynamics Corporation

Hayward, CA, May 5th, 2011: Delphon Industries, a leader in handling, processing, and packaging of high technology components and medical devices announced today a partnership with Neu Dynamics Corporation to offer turnkey packaging solutions. Neu Dynamics has provided tool and die manufacturing and precision mold making, including encapsulation mold making and…

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Quik-Pak Announces Open-molded Plastic Packages (OmPP)

San Diego, CA, April 12, 2011:Quik-Pak, a division of Delphon Industries and a leader in Microelectronic Packaging and Assembly, announces an exclusive Open-molded Plastic Package (OmPP)™. A pre-molded QFN (Quad Flat No-Lead) designed to provide a high quality, fast solution for IC packaging and assembly needs.

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