Quik-Pak Acquires Wafer-Preparation Firm QBBS
San Diego, CA – November 25, 2019: Quik-Pak gains volume capacity for wafer backgrinding to accommodate growing market demands. Download Press Release
Blog
Quik-Pak Names Ken Molitor Chief Operating Officer
San Diego, CA – July 17, 2019: Quik-Pak, a division of Promex Industries, has named Ken Molitor Chief Operating Officer. In this new position, Molitor will be responsible for all operations at the San Diego facility, including executing the current strategy to grow the business, monitoring financial performance, expanding production […]
Promex Quik-Pak Return to IEEE Long Island RF/Microwave Symposium with Quick-Turn Air Cavity QFNs for Microwave, Millimeter Wave and RF Applications
Promex and its Quik-Pak Division return to the IEEE Long Island RF/Microwave Symposium, the area’s premier annual event for engineers, managers and technical professionals in the microwave, millimeter wave and RF community. Download Flyer
Promex and Quik-Pak Employees Donate Truckloads of Gifts to Toys R Tots
Santa Clara, CA – December 21, 2018: Promex and Quik-Pak joined tens of thousands of volunteers working with 800 community action programs across the US, in Puerto Rico and the Virgin Islands to donate toys to less fortunate children. Download Press Release
Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium, September 18-19, Binghamton, New York
Santa Clara, CA – August 27, 2018: The Quik-Pak Division of Promex will exhibit air cavity plastic QFNs and overmolded QFNs at the 30th Annual Electronics Packaging Symposium (EPS), September 18 – 19, 2018 in Binghamton, New York. Download Press Release
Promex Quik-Pak Exhibits Air Cavity Plastic and Overmolded QFNs in Booth 809 at IEEE MTT International Microwave Symposium (IMS) June 10 – 15
San Diego, CA – June 8, 2018: Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15, […]
Quik-Pak, Promex Upcoming Tradeshows
San Diego, CA – May 25, 2018: ECTC, May 29 – June 1, 2018, Booth #408 / IMS, June 12 – June 14, 2018, Booth #809 / Sensors Expo & Conference, June 26 – June 28, 2018, Booth #1526.
Quik-Pak Exhibits Prototype Services for RF Devices and Sensors Supporting 5G and IoT in Booth 408 at ECTC in San Diego, May 29 – June 1, 2018
San Diego, CA – May 29, 2018: Quik-Pak, a division of Promex and provider of IC packaging, assembly, and wafer preparation services, is exhibiting prototype services for RF devices and sensors supporting 5G and IoT in Booth 408 at the Electronic Components and Technology Conference. Download Press Release
Five-Day Delivery of Overmolded QFNs from Quik-Pak San Diego
San Diego, CA – March 5, 2018: Quick-Turn Engineering Builds of Custom Designs Available Five Weeks After Drawing Approval; QFNs on Display at APEC Conference in San Antonio, TX March 5-7, 2018 Booth #758 & GOMATECH Conference in Miami, FL March 12-15, 2018 Booth #318 Download Press Release
Quik-Pak Installs New QFN Production Line in San Diego
San Diego, CA – October 10, 2017: Microelectronic Packaging and Assembly Solutions Provider Exhibits at IMAPS 2017 International Symposium Oct. 10-11, Raleigh, NC, Booth 210 Download Press Release
Quik-Pak, Promex Promote Advanced Packaging, Heterogeneous Assembly at Two Industry Events in New York, Washington D.C., Sept. 19-22, 2017
Santa Clara, CA – September 19, 2017: Electronic Packaging Symposium (EPS), International Conference on Silicon Carbide & Related Materials (ICSCRM) Provide Opportunities to Share Advances, Investigate Future Solutions Download Press Release
Quik-Pak Exhibits Air Cavity Plastic QFNs, Overmolded QFNs at IEEE MTT International Microwave Symposium (IMS) June 4-9, Honolulu HI, Booth 732
San Diego, CA – PR Newswire June 1, 2017: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic QFN Packages and Overmolded QFN Packages in Booth 732 at the IEEE MTT International Microwave Symposium (IMS), June 4-9, 2017 in Honolulu, HI. […]