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3dInCites Podcast: A Conversation about Onshore Advanced Packaging in the US

The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which […]

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Rethinking “Business as Usual”

By Rosie Medina, Vice President, Sales and Marketing Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like […]

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QP Technologies™ Expands Interposer Design Capabilities

Leverages Substrate Design Services to Create Flexible, Low-Cost Packaging Solutions ESCONDIDO, Calif. – March 29, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded capabilities related to interposer designs for flip-chip and large-cavity packaging as an extension of the company’s substrate design services announced last year. […]

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Quik-Pak Becomes QP Technologies™

New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) — Leading provider of microelectronic packaging and assembly solutions Quik-Pak today announced the business’s new name QP Technologies™. This change and the related rebranding are a natural outgrowth of the company’s evolution, including […]

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New Year, New Name, More Capabilities

By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new, […]

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Evolving Heterogeneous Integration Roadmap Highlights Trends

As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured components into higher-level assemblies such as systems-in-package (SiPs), offering higher bandwidth and functionality and lower power consumption in […]

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