News & Blog


Five-Day Delivery of Overmolded QFNs from Quik-Pak San Diego

San Diego, CA – March 5, 2018: Quick-Turn Engineering Builds of Custom Designs Available Five Weeks After Drawing Approval; QFNs on Display at APEC Conference in San Antonio, TX March 5-7, 2018 Booth #758 & GOMATECH Conference in Miami, FL March 12-15, 2018 Booth #318 Download Press Release

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Promex Showcases Heterogenous Assembly Services for Complex Devices, Quik-Pak Features Advanced Packages, in Booth 215 at ECTC, May 30-June 2, Lake Buena Vista, FL

SANTA CLARA, CA - MAY 2, 2017: Promex will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in…

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Quik-Pak Wins IMAPS 2016 Corporate Recognition Award for Significant Technical Contributions to the Microelectronics Industry

SAN DIEGO, CA – SEPTEMBER 11, 2016: Quik-Pak, a provider of microelectronic chip packaging and assembly solutions, will receive the International Microelectronics Assembly and Packaging Society (IMAPS) 2016 Corporate Recognition Award at the industry organization’s 49th International Symposium on Microelectronics on October 11, 2016 in Pasadena, Calif. Download Press Release

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