News & Blog


RF/Microwave Packaging Demands on the Rise

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the…

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Quik-Pak Relocates to Larger, Customized Facility

New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release

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Quik-Pak Announces Substrate Development Service

San Diego, CA - February 11, 2020: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least…

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Quik-Pak Names Ken Molitor Chief Operating Officer

San Diego, CA - July 17, 2019: Quik-Pak, a division of Promex Industries, has named Ken Molitor Chief Operating Officer. In this new position, Molitor will be responsible for all operations at the San Diego facility, including executing the current strategy to grow the business, monitoring financial performance, expanding production…

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Five-Day Delivery of Overmolded QFNs from Quik-Pak San Diego

San Diego, CA – March 5, 2018: Quick-Turn Engineering Builds of Custom Designs Available Five Weeks After Drawing Approval; QFNs on Display at APEC Conference in San Antonio, TX March 5-7, 2018 Booth #758 & GOMATECH Conference in Miami, FL March 12-15, 2018 Booth #318 Download Press Release

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