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New Year, New Name, More Capabilities

By Ken Molitor, Chief Operating Officer, QP Technologies A new year always brings the promise of a fresh start, a chance to reset, reinvigorate and perhaps refocus goals and objectives. This may never have been truer than when 2021 arrived. In February 2020, we moved our operations into our new,…

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Evolving Heterogeneous Integration Roadmap Highlights Trends

As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured components into higher-level assemblies such as systems-in-package (SiPs), offering higher bandwidth and functionality and lower power consumption in…

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Wafer Preparation: Thin Is In

The push to create smaller, thinner and denser chip packages is on… and has been for some time. A few years ago, it became clear that the way forward for the semiconductor industry was to intensify the focus on heterogeneous integration (HI)—integrating separately manufactured components into a system-in-package (SIP), a…

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Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices

Collaboration Targets Packaging for Millimeter-Wave Applications Escondido, CA – October 6, 2020: Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak openmolded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of…

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RF/Microwave Packaging Demands on the Rise

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the…

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Quik-Pak Relocates to Larger, Customized Facility

New 20,000 SF Building Is Operational and Supporting Essential Businesses Escondido, CA – April 7, 2020: Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all operations to its new facility at 2063 Wineridge Place in Escondido. Download Press Release

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Quik-Pak Announces Substrate Development Service

San Diego, CA - February 11, 2020: Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least…

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Quik-Pak Names Ken Molitor Chief Operating Officer

San Diego, CA - July 17, 2019: Quik-Pak, a division of Promex Industries, has named Ken Molitor Chief Operating Officer. In this new position, Molitor will be responsible for all operations at the San Diego facility, including executing the current strategy to grow the business, monitoring financial performance, expanding production…

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